Sekisui Chemical opens laminated-glass interlayer design center in Shanghai
R&D FacilitiesChinaEV-battery
Sekisui Chemical opened a design center in Shanghai in July 2026, operated by Sekisui Interlayer (Suzhou) Co., Ltd., to support automotive manufacturers with CMF design, simulations, sample production and prototype evaluation. The center combines the group's laminated-glass interlayer technology with Chinese mobility design trends and is intended to support development from concept through mass-production studies.
Sakata Seed Corporation plans to develop a research facility in Kakegawa, Shizuoka. The project has a total planned investment of JPY 2.115 billion, with construction starting in February 2026 and completion scheduled for May 2027.
Yukiguni Factory will open the Kinoko Mirai Lab on July 6, 2026, in Kawaguchi, Saitama. The new R&D hub will combine existing mushroom research with research into functional materials and new technologies, supporting collaboration with customers and universities and the creation of new businesses.
ADEKA has begun full-scale operations at its new Semiconductor Innovation Center within the ADEKA Technology Center Kuki in Saitama. The facility consolidates and expands semiconductor-materials research, with cleanrooms and evaluation equipment for advanced front-end and back-end semiconductor materials.
TOTO will build a new R&D building within its Chigasaki plant in Kanagawa to accelerate development of next-generation electrostatic chucks and AD components for semiconductor manufacturing equipment. The facility will expand prototype production lines and is scheduled to start construction in December 2026 and be completed in April 2028.
Yokowo's Chinese subsidiary Dongguan Youhua Communication Parts Co., Ltd. established a new anechoic chamber at the factory site of its affiliated manufacturing company in Dongguan, Guangdong. Test operation began in June 2026, with full operation scheduled for the end of June, enabling local evaluation and analysis of automotive antennas for GNSS, ETC, 4G, 5G and V2X applications.