Sony Semiconductor and TSMC to add next-gen image-sensor line at ¥180bn Kumamoto fab

Sony Semiconductor Solutions and TSMC signed a basic agreement toward a strategic partnership on next-generation image sensors, considering a joint venture and development/production lines at Sony's new fab under construction in Koshi, Kumamoto. Total investment is about ¥180bn for roughly 10,000 wafers/month (300mm-equivalent), with supply from May 2029; the project is eligible for up to ¥60bn of METI support.