Sony Semiconductor Solutions and TSMC signed a basic agreement toward a strategic partnership on next-generation image sensors, considering a joint venture and development/production lines at Sony's new fab under construction in Koshi, Kumamoto. Total investment is about ¥180bn for roughly 10,000 wafers/month (300mm-equivalent), with supply from May 2029; the project is eligible for up to ¥60bn of METI support.
Tamagawa Electronics, a subsidiary of Tamagawa Holdings, plans to build a second factory near its headquarters in Ayase, Kanagawa, to expand production capacity for telecommunications and electronic equipment serving social infrastructure demand. JFE Conform has been selected as the planned construction contractor, with handover scheduled for December 2027.
Kioxia Corporation plans to construct K3, a new manufacturing building at its Kitakami Plant in Iwate, Japan. The project expands the company's domestic 3D flash-memory manufacturing capacity; the disclosure does not state an investment amount, capacity, contractor, or schedule.
HOYA Electronics Singapore plans to rationalize and expand its electronics product manufacturing equipment at its Tampines Industrial Crescent facility in Singapore. The project has a total planned investment of JPY 10.89 billion, funded internally; no construction schedule or added capacity was disclosed.
HOYA Glass Disk Vietnam II plans to rationalize and expand its electronics product manufacturing equipment at its facility in Hung Yen, Vietnam. The project has a total planned investment of ¥7.631 billion, funded internally; no construction schedule or added capacity is disclosed.
HOYA plans a ¥5.695 billion investment to rationalize and expand electronics-related product manufacturing equipment at its Nagasaka, Hachioji, and Akishima factories. The projects are located in Hokuto, Yamanashi, and Hachioji and Akishima, Tokyo; no construction schedule or post-investment capacity is disclosed.