Sumitomo Osaka Cement plans to expand production capacity for electronic materials used in semiconductor manufacturing equipment by constructing a new production building and related facilities at its Shin Materials Division in Ichikawa, Chiba. The total planned investment is ¥13.105 billion, with construction scheduled from July 2023 through March 2027.
Ricoh will construct a new four-story building at its existing Atsugi site in Kanagawa to consolidate manufacturing functions and expand inkjet-head production and supply capacity. The facility will introduce automated lines, robots, AI and digital manufacturing technologies, with production capacity ultimately expandable to more than twice the current level.
NHK Spring will invest approximately ¥5 billion to add HDD suspension production lines at multiple domestic and overseas production sites, in response to rising demand for AI-related and data-center applications. The company states this investment is incremental to, and separate from, the approximately ¥35 billion Thailand suspension-plant investment it announced on 2026-07-16; operations are scheduled to start sequentially from 2027.
Murata Electronics (Thailand), a production subsidiary of Murata Manufacturing, will invest approximately ¥6.2 billion to build a new production building on its existing site in Thailand. Construction is scheduled to start in September 2026 and the building is expected to be completed in November 2027, including production equipment to meet rising demand for EMI noise-removal filters.
Tamagawa Electronics, a subsidiary of Tamagawa Holdings, plans to build a second factory near its headquarters in Ayase, Kanagawa, to expand production capacity for telecommunications and electronic equipment serving social infrastructure demand. JFE Conform has been selected as the planned construction contractor, with handover scheduled for December 2027.
Kioxia Corporation plans to construct K3, a new manufacturing building at its Kitakami Plant in Iwate, Japan. The project expands the company's domestic 3D flash-memory manufacturing capacity; the disclosure does not state an investment amount, capacity, contractor, or schedule.