Fujifilm has completed a new building at the Oita plant of Fujifilm Electronics Materials Co., Ltd. and began operations in August 2026. The facility manufactures and tests post-CMP cleaners, adding automated production equipment and quality-evaluation instruments to expand the plant's manufacturing capacity to three times its previous level, supporting growing AI-semiconductor demand.
ADEKA will expand production equipment for photo-acid generators used in advanced semiconductor photoresists, including EUV lithography, by adding a manufacturing line inside an existing building at its Chiba plant in Sodegaura. The approximately ¥1 billion investment is scheduled to start construction in January 2027, finish in February 2028, and begin commercial operations in September 2028, doubling capacity from the current level.
Denco Techno Heat, a wholly owned subsidiary of DKK Co., Ltd., will relocate its Suzuka factory to a newly acquired site in Kono-cho, Suzuka, Mie. The new facility will use DX, robotics and automated induction-heating equipment to raise production capacity by 30% versus the existing plant, with a planned 244 kW self-consumption solar installation. The factory building is scheduled for completion in March 2027, with all equipment relocation due to finish in January 2028.
Tokuyama held the opening ceremony for a new semiconductor-grade polysilicon plant operated by its wholly owned subsidiary Tokuyama Vietnam in the Phu My 3 Special Industrial Park, Ho Chi Minh City. The facility will crush and wash polysilicon and serve as an overseas supply-chain hub, with trial operations and quality verification to follow.
Mitsubishi Chemical will commercialize ultra-high-purity colloidal silica for polishing slurries used in advanced semiconductor manufacturing by installing new production equipment at its Kyushu Plant in Kitakyushu, Fukuoka. Commercial operations are scheduled to begin in October 2028, supporting semiconductor materials demand driven by generative AI and data centers.
Mitsui Kinzoku plans to acquire land near its existing Malaysian plant and establish a new site from 2031 onward to expand production of VSP high-frequency printed-circuit-board copper foil and MicroThin carrier-supported ultra-thin copper foil. The new site is planned to add monthly capacity of 1,200 tonnes of VSP foil and 4 million sqm of MicroThin foil, supporting rising AI, semiconductor and data-center demand.