Factory/PlantMaterials & chemicalsOverseas
Mitsui Kinzoku to establish new copper foil production site in Malaysia
Mitsui Kinzoku Co., Ltd.MalaysiaPublished
InvestmentNot disclosed
PhasePlanned
StartJan 2031
Completion—
20272028202920302031
Construction starts in about 51 months; completion is scheduled about 51 months from now.
Mitsui Kinzoku plans to acquire land near its existing Malaysian plant and establish a new site from 2031 onward to expand production of VSP high-frequency printed-circuit-board copper foil and MicroThin carrier-supported ultra-thin copper foil. The new site is planned to add monthly capacity of 1,200 tonnes of VSP foil and 4 million sqm of MicroThin foil, supporting rising AI, semiconductor and data-center demand.
Project facts
- Owner
- Mitsui Kinzoku Co., Ltd.
- Listing
- 5706 Tokyo
- Facility
- Factory/Plant
- Sector
- Materials & chemicals
- Location
- Malaysia (overseas)
- Investment
- Not disclosed
- Scale / capacity
- VSP foil: 1,200 tonnes/month; MicroThin foil: 4 million sqm/month; combined planned capacity including existing capacity: VSP foil 2,600 tonnes/month and MicroThin foil 12 million sqm/month
- Construction start
- Jan 2031
- Announced
- Aug 17, 2026
- Themes
- AI-infrastructure, semiconductor-supply-chain
Figures and schedules are as announced by the company or the public body concerned; plans can change. Amounts that were not disclosed are recorded as not disclosed, never estimated.