JScope

DISCO Corporation

DISCO manufactures precision processing equipment and tools for semiconductor and electronics production, including dicing saws, grinders, polishers, wafer mounters and dicing blades.

TSE 61462 tracked projects¥48.7B disclosed

Sectors

Machinery & robotics

Where it builds

Hiroshima, Tokyo

Stage

2 building

Every tracked project

2
2 projects for members

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