Toshiba Information Equipment Philippines has expanded production lines at its Laguna Technopark facility and shipped its first nearline HDDs for data centers. The company aims to approximately double total annual production capacity on a storage-capacity basis by FY2027 versus FY2025, supporting demand from generative AI and cloud services.
Okayama Prefecture announced that Okayama Murata Manufacturing will use the prefecture's Large Investment and Base Development Promotion Subsidy for an equipment investment of approximately 9 billion yen to expand the ceramic raw material production line at its main plant in Setouchi, Okayama. Construction is scheduled to start in October 2026, with operation beginning in April 2028.
MEC will make an additional investment in equipment at its Kitakyushu Factory, the second phase of the site's development. The expansion will address rising demand for chemicals used in semiconductor package substrates, driven in part by generative AI investment, with operations planned to start in FY2028.
Nippon Precision Electronics has signed a location agreement with Arao City, Kumamoto Prefecture, to expand its factory. The project will increase supply capacity for parts used in semiconductor manufacturing equipment amid strong growth in the semiconductor market.
Shinko Electric Industries will acquire Japan Display's Mobara plant in Chiba and convert it into a new core facility for advanced semiconductor packaging, particularly flip-chip packages used in AI-related semiconductors. The company plans to begin operations in FY2028, while selling the plant's western area to partner FICT for its own manufacturing use; Shinko will develop additional equipment investment plans for the retained site.
TOPPAN opened its first overseas FC-BGA substrate production facility at its Singapore subsidiary, Advanced Substrate Technologies, to supply large, high-layer-count substrates for AI, machine learning and network equipment. The first phase covers approximately 70,000 sqm within a roughly 95,000 sqm facility, with production scheduled to start in December 2026 and more than 200 engineers and technicians employed.
Ricoh will construct a new four-story building at its existing Atsugi site in Kanagawa to consolidate manufacturing functions and expand inkjet-head production and supply capacity. The facility will introduce automated lines, robots, AI and digital manufacturing technologies, with production capacity ultimately expandable to more than twice the current level.
NHK Spring will invest approximately ¥5 billion to add HDD suspension production lines at multiple domestic and overseas production sites, in response to rising demand for AI-related and data-center applications. The company states this investment is incremental to, and separate from, the approximately ¥35 billion Thailand suspension-plant investment it announced on 2026-07-16; operations are scheduled to start sequentially from 2027.
Murata Electronics (Thailand), a production subsidiary of Murata Manufacturing, will invest approximately ¥6.2 billion to build a new production building on its existing site in Thailand. Construction is scheduled to start in September 2026 and the building is expected to be completed in November 2027, including production equipment to meet rising demand for EMI noise-removal filters.
Tamagawa Electronics, a subsidiary of Tamagawa Holdings, plans to build a second factory near its headquarters in Ayase, Kanagawa, to expand production capacity for telecommunications and electronic equipment serving social infrastructure demand. JFE Conform has been selected as the planned construction contractor, with handover scheduled for December 2027.
Kioxia Corporation plans to construct K3, a new manufacturing building at its Kitakami Plant in Iwate, Japan. The project expands the company's domestic 3D flash-memory manufacturing capacity; the disclosure does not state an investment amount, capacity, contractor, or schedule.
Sekisui Chemical opened a design center in Shanghai in July 2026, operated by Sekisui Interlayer (Suzhou) Co., Ltd., to support automotive manufacturers with CMF design, simulations, sample production and prototype evaluation. The center combines the group's laminated-glass interlayer technology with Chinese mobility design trends and is intended to support development from concept through mass-production studies.
Lintec will invest approximately ¥20 billion to build the Semiconductor Solution Lab in Itoshima, Fukuoka, a co-development site for process materials, direct materials and related equipment used in semiconductor mid-stage processes. Completion is planned for October 2028; a location agreement with Fukuoka Prefecture and the city is to be signed on 21 August 2026.
Shikoku Kasei Industries will build a new advanced semiconductor materials manufacturing plant in Sakaide, Kagawa Prefecture to meet growing demand for high-performance semiconductors driven by AI and 5G adoption. The facility will introduce state-of-the-art production equipment and establish high-level quality management systems, with operations planned to begin July 2027 and 20 new employees.
Hokkaido University's Semiconductor Frontier Education and Research Organization (IFERS) held the opening ceremony for its 'Semiconductor Prototyping Lab' on the university campus in Sapporo on July 29, 2026, offering hands-on training in semiconductor manufacturing processes with an ISO Class 5/7 cleanroom. The lab is supported by the Cabinet Office's regional university and industry creation grant program together with Hokkaido, Sapporo and Chitose, with full fit-out expected by the end of fiscal 2027.
Resonac Holdings will make an additional investment of approximately ¥15 billion at its Resonac HD Singapore subsidiary to expand hard disk media production capacity, driven by growing AI and cloud-driven demand for datacenter storage. Combined with a prior May 2026 expansion announcement, total capacity will rise 44% from about 160 million disks to about 230 million disks per year, with production lines to be brought online progressively from 2029. Resonac, a key merchant supplier of hard disk media to HDD makers, has also agreed on a price revision with customers to reflect the investment.
Nunome Denki held a groundbreaking (jichinsai) ceremony for a new factory to produce semiconductor manufacturing equipment in Shirakawa City, Fukushima Prefecture. The project adds to Japan's semiconductor equipment supply chain capacity in the Tohoku region.
Israeli chipmaker Tower Semiconductor will build an additional 300mm manufacturing facility next to its Fab 7 in Uozu, Toyama Prefecture, Japan, as "Track Two" of a broader expansion. Total investment is approximately $3 billion, of which the Government of Japan is providing about $1 billion in grants (net investment ~$2 billion). The new fab targets a multi-fold increase in Silicon Photonics and Silicon Germanium capacity and is expected to be accretive from 2029. The expansion is run through TPSCo (Tower Panasonic Semiconductor Company), 51% owned by Tower.
Japan's Meiko Corporation (Ayase, Kanagawa) will inject USD 20 million (about JPY 3.26 billion) into its Hanoi-based consolidated subsidiary Meiko Electronics Quang Minh (MKQC), raising its capital to USD 30 million. The funds will be used to build a third factory at MKQC's Quang Minh industrial park site as part of Meiko's mid-term growth investment plan, with the capital injection due August 25.
Fujifilm and its India subsidiary FUJIFILM India signed a non-binding MoU with the Indian government on July 3, 2026 to explore establishing a semiconductor materials manufacturing facility in India. The move aims to strengthen collaboration with Japanese and Indian industry to build a robust local semiconductor supply chain, supporting India's 'Make in India' initiative.
Furuya Metal, a leading platinum-group-metal (PGM) processor, is building a new plant in Chitose, Hokkaido to produce thermal management substrates (quartz-based temperature sensors) for semiconductor manufacturing equipment such as diffusion furnaces. The plant, costing about JPY 4.5 billion and equipped with automated production systems, is scheduled for completion in July 2026, boosting capacity and supporting BCP resilience alongside its Tsukuba (Chikusei, Ibaraki) plant.
Izumo Murata Manufacturing, a production subsidiary of Murata Manufacturing, has completed a new production building at its Izumo, Shimane Prefecture site for multilayer ceramic capacitors (MLCCs). Construction began in March 2024 on the 10-story steel-frame building, with total investment including production equipment reaching approximately JPY 47 billion, as Murata continues to diversify MLCC production across Japan, ASEAN, and China to build a flexible, resilient supply chain.
Mitsubishi Cable Industries has completed construction of a new 'Kumagaya No. 2 Plant' at its Kumagaya site in Saitama Prefecture to strengthen production of high-value-added seal products for semiconductor manufacturing equipment and pneumatic devices. The plant, built at a cost of JPY 4.35 billion, completed construction on March 31, 2026 and is scheduled to begin mass production in July 2026, complementing the No. 1 plant that began operations in 2023.
Asahi Kasei's Taiwan subsidiary Hua Xu Technology has completed a new slitting facility in the Guantian Industrial Park, Tainan, for its Sunfort photosensitive dry film resist used in advanced semiconductor packaging, at an investment of about JPY 2 billion. The plant expands Hua Xu's overall slitting capacity by roughly 1.4x, with a design allowing expansion up to about 2x current capacity to meet growing demand tied to AI-driven chip packaging.
EIZO, a major monitor maker headquartered in Ishikawa Prefecture, plans to construct a new factory near Mumbai, India, with shipments expected to start as early as July 2028. The plant will target medical, aviation control, and video production monitor markets, and will house the headquarters functions of EIZO's Mumbai sales subsidiary established in 2023.
NHK Spring (Nippon Hatsujo) plans to invest approximately JPY 15 billion in a new production building at its Thai subsidiary NHK Spring (Thailand)'s Wellgrow plant in Chachoengsao to increase production capacity for HDD suspensions, a key component. The building is scheduled for completion in December 2027, and will raise the site's HDD suspension capacity by up to 1.6x; the company plans roughly JPY 35 billion in total investment across further phases to meet rising demand from AI-related data centers.
On its Q2 2026 earnings call, TSMC chairman and CEO C.C. Wei said the company is trying to bring up its new fab in Japan (Kikuyo, Kumamoto) as fast as possible, citing a large gap between AI-driven chip demand and supply. TSMC separately said it is executing a global plan to add three more 3-nanometer fabs, one each in Taiwan, Arizona and Japan. The transcript does not name a specific fab number, investment amount or completion date for the Japan facility.
Micron broke ground on a new cleanroom building at its Hiroshima fab (Higashihiroshima) to scale production of advanced memory for AI, committing about ¥1.5 trillion in total across the phased build-out. Phase I covers roughly 28,000 sqm; Fujita Corporation is the general construction partner, with production equipment move-in slated for late 2028. The fab - Japan's only DRAM manufacturing site, rooted in the former Elpida operation - will produce next-generation memory including EUV-based 1-gamma DRAM. The project is backed by up to ¥536bn of METI support announced in September 2025.
Kanken Techno signed a location agreement with Tamana City, Kumamoto Prefecture, to expand its factory producing exhaust gas treatment and air pollution control equipment used in semiconductor manufacturing. The expansion aims to double production capacity in response to semiconductor market demand, with investment of approximately JPY 1.363 billion and about 48 new jobs planned.
Sony Semiconductor Solutions and TSMC signed a basic agreement toward a strategic partnership on next-generation image sensors, considering a joint venture and development/production lines at Sony's new fab under construction in Koshi, Kumamoto. Total investment is about ¥180bn for roughly 10,000 wafers/month (300mm-equivalent), with supply from May 2029; the project is eligible for up to ¥60bn of METI support.
NGK Insulators will invest about ¥70bn to build a new production site in Nomi, Ishikawa for ceramics used in semiconductor manufacturing equipment. Output will be handled by subsidiary NGK Ceramic Device, with mass production targeted from October 2029, to meet demand growth driven by AI-era chip investment.
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