Kokusai Semiconductor Equipment Corporation is investing ¥18.702 billion in development and evaluation facilities in Oregon, United States, for batch deposition equipment and single-wafer plasma treatment equipment. Construction began in November 2024 and completion is scheduled for December 2026.
HOYA Electronics Singapore plans to rationalize and expand its electronics product manufacturing equipment at its Tampines Industrial Crescent facility in Singapore. The project has a total planned investment of JPY 10.89 billion, funded internally; no construction schedule or added capacity was disclosed.
HOYA Glass Disk Vietnam II plans to rationalize and expand its electronics product manufacturing equipment at its facility in Hung Yen, Vietnam. The project has a total planned investment of ¥7.631 billion, funded internally; no construction schedule or added capacity is disclosed.
HOYA plans a ¥5.695 billion investment to rationalize and expand electronics-related product manufacturing equipment at its Nagasaka, Hachioji, and Akishima factories. The projects are located in Hokuto, Yamanashi, and Hachioji and Akishima, Tokyo; no construction schedule or post-investment capacity is disclosed.
HOYALaos Co., Ltd plans to rationalize and expand electronics-product manufacturing equipment at its Vientiane facility in Laos. The project has a planned total investment of ¥8.168 billion, funded internally; no construction schedule or capacity increase is disclosed.
Sekisui Chemical plans to invest JPY 3.158 billion in new semiconductor product production equipment at its Musashi Plant in Hasuda, Saitama. Construction started in February 2024 and is scheduled for completion in September 2029, funded by internal funds and borrowings.