Asahi Kasei's Taiwan subsidiary Hua Xu Technology has completed a new slitting facility in the Guantian Industrial Park, Tainan, for its Sunfort photosensitive dry film resist used in advanced semiconductor packaging, at an investment of about JPY 2 billion. The plant expands Hua Xu's overall slitting capacity by roughly 1.4x, with a design allowing expansion up to about 2x current capacity to meet growing demand tied to AI-driven chip packaging.
Company
Asahi Kasei Corporation
Investment
¥2B total
Location
Taiwan, Tainan
Capacity
approx. 1.4x prior slitting capacity (expandable to approx. 2x)
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