Shikoku Kasei Industries will build a new advanced semiconductor materials manufacturing plant in Sakaide, Kagawa Prefecture to meet growing demand for high-performance semiconductors driven by AI and 5G adoption. The facility will introduce state-of-the-art production equipment and establish high-level quality management systems, with operations planned to begin July 2027 and 20 new employees.
Murata Electronics (Thailand), a production subsidiary of Murata Manufacturing, will invest approximately ¥6.2 billion to build a new production building on its existing site in Thailand. Construction is scheduled to start in September 2026 and the building is expected to be completed in November 2027, including production equipment to meet rising demand for EMI noise-removal filters.
Tamagawa Electronics, a subsidiary of Tamagawa Holdings, plans to build a second factory near its headquarters in Ayase, Kanagawa, to expand production capacity for telecommunications and electronic equipment serving social infrastructure demand. JFE Conform has been selected as the planned construction contractor, with handover scheduled for December 2027.
Kioxia Corporation plans to construct K3, a new manufacturing building at its Kitakami Plant in Iwate, Japan. The project expands the company's domestic 3D flash-memory manufacturing capacity; the disclosure does not state an investment amount, capacity, contractor, or schedule.
Sekisui Chemical opened a design center in Shanghai in July 2026, operated by Sekisui Interlayer (Suzhou) Co., Ltd., to support automotive manufacturers with CMF design, simulations, sample production and prototype evaluation. The center combines the group's laminated-glass interlayer technology with Chinese mobility design trends and is intended to support development from concept through mass-production studies.
HOYA Electronics Singapore plans to rationalize and expand its electronics product manufacturing equipment at its Tampines Industrial Crescent facility in Singapore. The project has a total planned investment of JPY 10.89 billion, funded internally; no construction schedule or added capacity was disclosed.