JScope
Factory/PlantSemiconductors & electronics

Shinko Electric Industries to acquire JDI Mobara plant for advanced semiconductor packaging

Shinko Electric Industries Co., Ltd.Mobara, ChibaPublished
InvestmentNot disclosed
PhasePlanned
Start—
CompletionApr 2028
To completion
Today
20272028

About 18 months to scheduled completion.

Shinko Electric Industries will acquire Japan Display's Mobara plant in Chiba and convert it into a new core facility for advanced semiconductor packaging, particularly flip-chip packages used in AI-related semiconductors. The company plans to begin operations in FY2028, while selling the plant's western area to partner FICT for its own manufacturing use; Shinko will develop additional equipment investment plans for the retained site.

Project facts

Owner
Shinko Electric Industries Co., Ltd.
Listing
6967 Tokyo
Facility
Factory/Plant
Sector
Semiconductors & electronics
Location
Mobara, Chiba, Japan
Investment
Not disclosed
Scale / capacity
373,482.91 sqm total site; 140,738.32 sqm retained by Shinko after transfer
Completion
Apr 2028
Announced
Sep 30, 2026
Themes
AI-infrastructure, semiconductor-supply-chain

Figures and schedules are as announced by the company or the public body concerned; plans can change. Amounts that were not disclosed are recorded as not disclosed, never estimated.

Also in Chiba10 projects · ¥51.9B disclosedOn the map →

Latest in Semiconductors & electronicsAll Semiconductors & electronics →

Toshiba Information Equipment Philippines expands HDD production lines for nearline drives

Semiconductors & electronicsPhilippinesCompleted

Toshiba Information Equipment Philippines has expanded production lines at its Laguna Technopark facility and shipped its first nearline HDDs for data centers. The company aims to approximately double total annual production capacity on a storage-capacity basis by FY2027 versus FY2025, supporting demand from generative AI and cloud services.

Okayama Murata Manufacturing to make major equipment investment at its Okayama site

Semiconductors & electronicsOkayamaPlanned¥9B

Okayama Prefecture announced that Okayama Murata Manufacturing will use the prefecture's Large Investment and Base Development Promotion Subsidy for an equipment investment of approximately 9 billion yen to expand the ceramic raw material production line at its main plant in Setouchi, Okayama. Construction is scheduled to start in October 2026, with operation beginning in April 2028.

MEC to expand Kitakyushu plant for semiconductor package substrate chemicals

Semiconductors & electronicsFukuokaPlanned¥2B

MEC will make an additional investment in equipment at its Kitakyushu Factory, the second phase of the site's development. The expansion will address rising demand for chemicals used in semiconductor package substrates, driven in part by generative AI investment, with operations planned to start in FY2028.