Tower Semiconductor to build new 300mm fab in Uozu, Japan, part of ~$3bn expansion

Israeli chipmaker Tower Semiconductor will build an additional 300mm manufacturing facility next to its Fab 7 in Uozu, Toyama Prefecture, Japan, as "Track Two" of a broader expansion. Total investment is approximately $3 billion, of which the Government of Japan is providing about $1 billion in grants (net investment ~$2 billion). The new fab targets a multi-fold increase in Silicon Photonics and Silicon Germanium capacity and is expected to be accretive from 2029. The expansion is run through TPSCo (Tower Panasonic Semiconductor Company), 51% owned by Tower.