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Tower Semiconductor to build new 300mm fab in Uozu, Japan, part of ~$3bn expansion

Semiconductors & electronicsToyamasemiconductor-supply-chainreshoring

Israeli chipmaker Tower Semiconductor will build an additional 300mm manufacturing facility next to its Fab 7 in Uozu, Toyama Prefecture, Japan, as "Track Two" of a broader expansion. Total investment is approximately $3 billion, of which the Government of Japan is providing about $1 billion in grants (net investment ~$2 billion). The new fab targets a multi-fold increase in Silicon Photonics and Silicon Germanium capacity and is expected to be accretive from 2029. The expansion is run through TPSCo (Tower Panasonic Semiconductor Company), 51% owned by Tower.

Company
Tower Semiconductor
Investment
$3B total; ~$1bn Japan gov't grants (net ~$2bn)
Location
Toyama, Uozu
Announced
Jul 14, 2026
ADR
TSEM
Phase
planned
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